发明名称 HEAT RADIATING STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat radiating structure which holds and fixes a substrate and a heat radiator effectively utilizing the thickness of the substrate and the radiator. <P>SOLUTION: The heat radiating structure includes a heating member 2 attached to one surface of a substrate 1, heat receiving members 4 and 5 which are arranged to face the substrate 1 so as to sandwich the heating member 2 and transport heat of the heating member 2 to a heat radiating portion 6. The heat radiating structure has a first engaging member 7, which engages with the substrate 1 and receives the load pressing the substrate toward the heat receiving member 4, and a second engaging member 8, which engages with the heat receiving member 4 and receives the load pressing the heat receiving member 4 toward the substrate 1. The first engaging member 7 engages and connects with the second engaging member 8 between the substrate 1 and the heat receiving member 4. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011258830(A) 申请公布日期 2011.12.22
申请号 JP20100133335 申请日期 2010.06.10
申请人 FUJIKURA LTD 发明人 YAMADA TADAO
分类号 H01L23/40 主分类号 H01L23/40
代理机构 代理人
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