POLISHING LIQUID FOR SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING SEMICONDUCTOR WAFER

摘要

Disclosed is a polishing liquid for a semiconductor substrate, which contains modified silica particles the surfaces of which are modified by an aluminate, a water-soluble polymer and water. The content of the water-soluble polymer is more than 0% by mass but 1.00% by mass or less based on the total mass of the polishing liquid for a semiconductor substrate, and the polishing liquid has a pH of 5.0-9.0 (inclusive). Also disclosed is a method for producing a semiconductor wafer, which comprises a polishing step wherein the surface of a semiconductor substrate is polished using the polishing liquid for a semiconductor substrate so as to obtain a semiconductor wafer.