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发明名称
化学机械研磨系统以及研磨液
摘要
申请公布号
TWI355023
申请公布日期
2011.12.21
申请号
TW095118821
申请日期
2006.05.26
申请人
安集微電子有限公司 開曼群島
发明人
杨春晓;俞昌
分类号
H01L21/304
主分类号
H01L21/304
代理机构
代理人
陶霖 台北市文山区景兴路202巷8号5楼
主权项
一种研磨液,用于化学机械抛光聚合物膜表面,该研磨液包含一研磨颗粒,以及选自由pH值调节剂、介面活性剂、氧化剂、Fe离子、Mn离子、Cu离子所组成之群组中之至少一种化学物质,其中该磨颗粒还包含Al以及催化剂,且被聚四氟乙烯包覆,所述研磨颗粒的含量为0.5-2重量%。
地址
开曼群岛
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