发明名称 Heat-sensitive adhesive material
摘要 <p>A heat-sensitive adhesive material according to the present invention includes a support, and a heat-sensitive adhesive layer on the support, the heat-sensitive adhesive layer comprises a water-dispersible heat-sensitive adhesive containing at least a thermoplastic resin, a solid plasticizer and a tackifer, wherein the thermoplastic resin is obtained by emulsion polymerization using a reactive surfactant and has a glass transition temperature (Tg) of lower than -20°C.</p>
申请公布号 EP2397531(A1) 申请公布日期 2011.12.21
申请号 EP20110169944 申请日期 2011.06.15
申请人 RICOH COMPANY, LTD. 发明人 YAMAGUCHI, TAKEHITO;SHIMBO, HITOSHI;KUGO, TOMOYUKI
分类号 C09J133/00;C08F2/24 主分类号 C09J133/00
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