| 摘要 |
<p>Provided is a surface machining method for performing machining such as cutting, grinding, electrical discharging or the like to obtain a planar material of a uniform thickness. This method includes the steps of mounting a planar material on a surface plate, setting the coordinate axis in the plane direction of the planar material to X, Y, and setting the coordinate axis in the height direction of the planar material to Z, virtualizing an XY plane including an origin of the Z direction measured as a distance (height) Zm, n from the coordinates (Xm, Yn) of a virtual plane ABCD to the plate thickness center plane S composed of midpoints of segments connecting an upper surface and a lower surface of the planar material as the object to be measured, measuring the distance (height) in the Z direction of the plate thickness center plane of the planar material from the origin in an arbitrary XY plane position, and tilting and cutting the planar material so that the difference between maximum and minimum value of the obtained height data will be minimum. This method aims to obtain a flat planar material of a uniform thickness from a planar material with two- or three-dimensional deformation and/or having variation in the plate thickness. Specifically, provided are a method and a device for determining a work surface of a planar material in a surface treatment for obtaining a flat planar material of a uniform thickness at minimal machining cost.</p> |
