| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive film which bonds an electronic part such as a semiconductor element to a lead frame and an insulating support substrate and has high adhesion at a high temperature, low stress properties, and low temperature adhesion with or without a substrate, a method for manufacturing the film, and a semiconductor device using the film. SOLUTION: The method for manufacturing the adhesive film comprises steps of (I) mixing 100 pts.wt. polyimide resin, 0.01-50 pts.wt. silane coupling agent to be represented by the formula (wherein X is a vinyl, amino, glycidoxy, methacryloxy, mercapto or isocyanate group; n is 1-10; and R1 is a 1-10C alkyl group), 0-200 pts.wt. thermosetting resin, and 0-8,000 pts.wt. filler in an organic solvent, (II) coating the resulting mixed fluid on a substrate, and (III) heating and drying the coated film. A semiconductor element is obtained by bonding a support member having the above adhesive film to the back surface of a semiconductor. The semiconductor device has an electronic part to which the semiconductor element has been bonded.</p> |
