发明名称 RADIATION-SENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR FORMING CURED FILM AND DISPLAY ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which achieves both storage stability and low temperature calcination and has sufficient resolution and radiation sensitivity, to provide a cured film which is superior in heat resistance, light resistance, chemical resistance, transmittance, flatness, and voltage holding ratio or the like which are required properties for this cured film, to provide a method for forming this cured film, and to provide a display element equipped with this cured film. <P>SOLUTION: The radiation-sensitive resin composition contains: [A] a compound having an epoxy group; [B] a polymerizable compound having an ethylenically unsaturated bond; [C] a radiation-sensitive polymerization initiator; and [D] a specific structure compound having an amino group and an electron-attracting group. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011257537(A) 申请公布日期 2011.12.22
申请号 JP20100131059 申请日期 2010.06.08
申请人 JSR CORP 发明人 YONEDA EIJI;NISHI NOBUHIRO;KODAMA SEIICHIRO;INOMATA KATSUMI
分类号 G03F7/004;C08F2/50;C08G59/32;G03F7/032;H01L21/027 主分类号 G03F7/004
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