POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION, AND TETRACARBOXYLIC ACID DIANHYDRIDE

摘要

PROBLEM TO BE SOLVED: To provide a polyimide precursor capable of obtaining a photosensitive cover lay with less warping after burning, high flame retardancy and high heat resistance; to provide a photosensitive resin composition using the precursor; and to provide a new tetracarboxylic acid dianhydride used for production thereof.

SOLUTION: The polyimide precursor is obtained by reacting tetracarboxylic acid dianhydride with diamine, and at least one component of the above dianhydride has a structure represented by general formula (1) (wherein R1is a divalent organic group having one or more ring structures; R2s are each a 2-10C alkylene group, and their structures may be the same or different; and m and n are each an integer of 1 or more, satisfy 2≤m+n≤60 and the total carbon number included in (m+n) pieces of R2is 5 or more).

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