发明名称 |
Simultaneous testing of semiconductor components on a wafer |
摘要 |
<p>Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.</p> |
申请公布号 |
EP2397862(A2) |
申请公布日期 |
2011.12.21 |
申请号 |
EP20110004345 |
申请日期 |
2011.05.26 |
申请人 |
BROADCOM CORPORATION |
发明人 |
BEHZAD, ARYA REZA;ZHAO, SAM ZIQUN;BOERS, MICHAEL;ROFOUGARAN, AHMADREZA;CASTANEDA, JESUS ALFONSO |
分类号 |
G01R31/319;G01R31/28;G01R31/302;G01R31/303;G01R31/317 |
主分类号 |
G01R31/319 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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