发明名称 |
Conductive interconnects |
摘要 |
A method of making a conductive interconnect structure includes the steps of: electrodepositing a metal on a conductive surface (4) of a carrier (2) to form a first elongate conductive interconnect (12); and electrodepositing a dielectric material (14) on said conductive interconnect (12) while the conductive interconnect (12) is in contact with the conductive surface (4). |
申请公布号 |
GB2454740(B) |
申请公布日期 |
2011.12.21 |
申请号 |
GB20070022613 |
申请日期 |
2007.11.19 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
JOHN CHRISTOPHER RUDIN;MIGUEL CARRASCO |
分类号 |
H01L29/423;G02F1/1362;H01L23/522 |
主分类号 |
H01L29/423 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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