STACK TYPE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A stacked semiconductor package is provided to make a single module of two chips with a penetration electrode, thereby improving reliability of a product by significantly increasing the stiffness of chip. CONSTITUTION: An encapsulating material(1) protects a first penetration electrode module(10), a second penetration electrode module(20), and a signal transmission medium(4). A substrate(2) supports the first penetration electrode module and the second penetration electrode module. The substrate comprises a substrate core(2b), a pattern layer(3), an upper protection layer(2a), and a lower protection layer(2c). The pattern layer is electrically connected to the signal transmission medium. The upper protection layer and lower protection layer protect a part of the pattern layer and the substrate core by covering the same.