发明名称 |
HEAT-RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>PURPOSE: A radiation substrate and a manufacturing method thereof are provided to release the heat generated from the heat generating element to the outside using alumina, which oxidizes a core metal layer, as a core insulating layer. CONSTITUTION: A radiation substrate(100a) includes a heat radiation part and a weak part to heat. The heat radiation part includes a core layer(110) and a circuit layer(120) which is formed in the first area(A) of the core layer. The weak part to heat includes a build-up layer(130) which is bonded in the second part(B) of the core layer through a bonding layer(140). The heat radiation part and the weak part to heat are thermally separated. An impregnation device(150) is impregnated in the bonding layer and is formed in the build-up layer. The core layer includes a core metal layer(111) and a core insulating layer(112). The core layer emits the heat generated from a heat generating device(160) to the outside.</p> |
申请公布号 |
KR20110136186(A) |
申请公布日期 |
2011.12.21 |
申请号 |
KR20100056029 |
申请日期 |
2010.06.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LIM, CHANG HYUN;KANG, JUNG EUN;CHOI, SEOG MOON;KIM, KWANG SOO;PARK, SUNG KEUN |
分类号 |
H05K1/02;H05K3/46;H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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