SEMICONDUCTOR PROTECTION FILM-FORMING FILM WITH DICING SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE

摘要

The present invention includes a dicing sheet-attached film for forming a semiconductor protection film (14), which protects a semiconductor element (18) mounted on a base material and positioned on the outermost side. The dicing sheet-attached film for forming a semiconductor protection film (14) comprises a protection film-forming layer (12) which is composed of a resin composition and protects a surface of the semiconductor element (18) opposite to the surface of the semiconductor element (18) mounted on the base material, and a dicing sheet (13) laminated on the protection film-forming layer.