发明名称 |
BINDER RESIN PRECURSOR SOLUTION COMPOSITION FOR ELECTRODE |
摘要 |
A binder resin precursor solution composition for electrode containing at least (A) a polyamic acid having repeating units represented by chemical formulae (1) and (2) in a (1) to (2) molar ratio of 2:8 to 8.5:1.5 and having a tetracarboxylic acid component to diamine component molar ratio of 0.94 to 0.99, (B) a carboxylic acid compound having two pairs of carboxyl groups in the molecule thereof or an ester thereof, and (C) a solvent. |
申请公布号 |
KR20110136804(A) |
申请公布日期 |
2011.12.21 |
申请号 |
KR20117020780 |
申请日期 |
2010.03.31 |
申请人 |
UBE INDUSTRIES, LTD. |
发明人 |
HIRANO TETSUJI;KIDOSAKI TORU |
分类号 |
H01M4/62;H01G11/28;H01G11/38;H01G11/50;H01M4/02;H01M4/04 |
主分类号 |
H01M4/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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