发明名称 BINDER RESIN PRECURSOR SOLUTION COMPOSITION FOR ELECTRODE
摘要 A binder resin precursor solution composition for electrode containing at least (A) a polyamic acid having repeating units represented by chemical formulae (1) and (2) in a (1) to (2) molar ratio of 2:8 to 8.5:1.5 and having a tetracarboxylic acid component to diamine component molar ratio of 0.94 to 0.99, (B) a carboxylic acid compound having two pairs of carboxyl groups in the molecule thereof or an ester thereof, and (C) a solvent.
申请公布号 KR20110136804(A) 申请公布日期 2011.12.21
申请号 KR20117020780 申请日期 2010.03.31
申请人 UBE INDUSTRIES, LTD. 发明人 HIRANO TETSUJI;KIDOSAKI TORU
分类号 H01M4/62;H01G11/28;H01G11/38;H01G11/50;H01M4/02;H01M4/04 主分类号 H01M4/62
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