CIRCUIT CONNECTING ADHESIVE FILM AND USE THEREOF, CIRCUIT CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME AND CIRCUIT MEMBER CONNECTING METHOD

摘要

PURPOSE: An adhesive film for the circuit connection, a use there, a circuit connection structure, a manufacturing method of the circuit connection structure, and a connection method of the circuit member are provided to secure excellent connection reliability when connecting a semiconductor device with a thin glass substrate. CONSTITUTION: An adhesive film(10) for the circuit connection comprises the following; a conductive adhesive layer(3b) including an adhesive composition(4b) and a conductive particle(5); and an insulating adhesive layer(3a) containing another adhesive composition(4a). The adhesive film electrically connects a first circuit member with a first circuit electrode around the main surface of a first circuit substrate, and a second circuit member with a second circuit electrode around the main surface of a second circuit substrate.