| 发明名称 |
Sensor module with mold encapsulation for applying a bias magnetic field |
| 摘要 |
A method of manufacturing a sensor module includes providing a substrate comprising a magnetically sensitive sensor element. The sensor element and the substrate are encapsulated with at least one mold material that is configured to apply a bias magnetic field to the sensor element. |
| 申请公布号 |
US8080993(B2) |
申请公布日期 |
2011.12.20 |
| 申请号 |
US20080056776 |
申请日期 |
2008.03.27 |
| 申请人 |
THEUSS HORST;WIETSCHORKE HELMUT;INFINEON TECHNOLOGIES AG |
发明人 |
THEUSS HORST;WIETSCHORKE HELMUT |
| 分类号 |
G01R33/07;G01R33/02;H01L27/22 |
主分类号 |
G01R33/07 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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