| 摘要 |
<p>A thin package and a multi package using the same are provided to improve the reliability of solder joints by electrically and physically connecting between a semiconductor chip and a lead frame using an ACF(Anisotropic Conductive Film). A thin package includes a lead frame(160), a semiconductor chip(110), a mold unit(180), and a mounting member. The lead frame includes a half etched inner lead and an outer lead. The semiconductor chip is attached to the half etched inner lead of the lead frame using an electrical and physical connecting member. The mold unit seals an upper surface of the semiconductor chip including the inner lead. The mounting member is attached to a lower surface of the outer lead of the lead frame exposed to outside of the mold unit.</p> |
