| 发明名称 |
Die-warpage compensation structures for thinned-die devices, and methods of assembling same |
| 摘要 |
A back-side lamination (BSL) is applied after thinning a microelectronic die. The BSL is configured to be a thermal-expansion complementary structure to a metal wiring interconnect layout that is disposed on the active side of the microelectronic die.
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| 申请公布号 |
US8080870(B2) |
申请公布日期 |
2011.12.20 |
| 申请号 |
US20090456638 |
申请日期 |
2009.06.18 |
| 申请人 |
HU CHUAN;INTEL CORPORATION |
发明人 |
HU CHUAN |
| 分类号 |
H01L23/34;H01L23/10 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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