发明名称 Metal line having a MoxSiy/Mo diffusion barrier of semiconductor device and method for forming the same
摘要 A metal line having a MoxSiy/Mo diffusion barrier of a semiconductor device and corresponding methods of fabricating the same are presented. The metal line includes an insulation layer, a diffusion barrier, and a metal layer. The insulation layer is formed on a semiconductor substrate and has a metal line forming region. The diffusion barrier is formed on a surface of the metal line forming region of the insulation layer and has a stack structure composed of a MoxSiy layer and a Mo layer. The metal layer is formed on the diffusion barrier which fills in the metal line forming region of the insulation layer.
申请公布号 US8080472(B2) 申请公布日期 2011.12.20
申请号 US20090472721 申请日期 2009.05.27
申请人 OH JOON SEOK;YEOM SEUNG JIN;KIM BAEK MANN;JUNG DONG HA;LEE NAM YEAL;KIM JAE HONG;HYNIX SEMICONDUCTOR INC. 发明人 OH JOON SEOK;YEOM SEUNG JIN;KIM BAEK MANN;JUNG DONG HA;LEE NAM YEAL;KIM JAE HONG
分类号 H01L21/425;H01L21/4763 主分类号 H01L21/425
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