发明名称 |
Method and apparatus for thermal modeling and analysis of semiconductor chip designs |
摘要 |
A method and apparatus for modeling and thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal testing of a semiconductor chip design includes calculating full-chip temperatures over the semiconductor chip design (e.g., to identify steep thermal gradients) and modeling the full-chip temperatures in accordance with a geometric multi-grid technique. The geometric multi-grid technique is tailored to determine temperatures within the semiconductor chip design based at least in part on the physical attributes or geometry of the design. |
申请公布号 |
US8082137(B2) |
申请公布日期 |
2011.12.20 |
申请号 |
US20080137344 |
申请日期 |
2008.06.11 |
申请人 |
LI PENG;PILEGGI LARRY;ASHEGHI MEHDI;CHANDRA RAJIT;GRADIENT DESIGN AUTOMATION, INC. |
发明人 |
LI PENG;PILEGGI LARRY;ASHEGHI MEHDI;CHANDRA RAJIT |
分类号 |
G06F17/50;G06F11/22 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|