| 摘要 |
PURPOSE: A manufacturing method of a multi-layered PCB for radiating heat is provided to reduce the number of a work processes without using a copper plate and a copper tape. CONSTITUTION: In a manufacturing method of a multi-layered PCB for radiating heat, a first copper layer, a first insulation layer, an aluminum layer, and a protection tape are laminated in a cutting process. A first hole penetrates upward and downward and is formed in a first manufacturing process. A second insulating and the second copper layer are laminated in the upper part of the first copper layer in a lamination process. A second hole passing through the second copper layer up and down in a second manufacturing process. A third hole passing through the second insulating layer in a drilling process.
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