| 摘要 |
A foldable microcircuit is initially a planar semiconductor wafer on which circuitry has been formed. The wafer is segmented into a plurality of tiles, and a plurality of hinge mechanisms are coupled between adjacent pairs of tiles such that the segmented wafer can be folded into a desired non-planar configuration having a high fill-factor and small gaps between tiles. The hinge mechanisms can comprise an organic material deposited on the wafer such that it provides mechanical coupling between adjacent tiles, with metal interconnections between tiles formed directly over the organic hinges, or routed between adjacent tiles via compliant bridges. Alternatively, the interconnection traces between tiles can serve as part or all of a hinge mechanism. The foldable microcircuit can be, for example, a CMOS circuit, with the segmented tiles folded to form, for example, a semi-spherical structure arranged to provide a wide FOV photodetector array.
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