发明名称 |
Modular liquid cooling system |
摘要 |
A method and kit of components for configuring electronics cooling configurations, the kit comprising a plurality of passageway forming members, each forming member including an extruded member having first and second ends and forming at least one passageway and at least one of an input port and an output port that opens into the passageway, each forming member also including at least one plug insert secured to the second end of the forming member to block the at least one passageway, a plurality of elastomeric seals, a plurality of mechanical fasteners, wherein forming members can be arranged adjacent each other with ports aligned and the fasteners can be used to mechanically fasten the forming members together with seals there between to form various cooling configurations. |
申请公布号 |
US8081462(B2) |
申请公布日期 |
2011.12.20 |
申请号 |
US20070854818 |
申请日期 |
2007.09.13 |
申请人 |
BALCERAK JOHN A.;DAY SCOTT D.;KEEGAN JEREMY J.;SIEBERT WILLIAM K.;GOLLHARDT NEIL;ROCKWELL AUTOMATION TECHNOLOGIES, INC. |
发明人 |
BALCERAK JOHN A.;DAY SCOTT D.;KEEGAN JEREMY J.;SIEBERT WILLIAM K.;GOLLHARDT NEIL |
分类号 |
H05K7/20;F28D15/00;F28F7/00;H01F27/08;H02B1/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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