发明名称 Deep trench electrostatic discharge (ESD) protect diode for silicon-on-insulator (SOI) devices
摘要 A semiconductor structure is disclosed. The semiconductor structure includes a bulk substrate of a first polarity type, a buried insulator layer disposed on the bulk substrate, an active semiconductor layer disposed on top of the buried insulator layer including a shallow trench isolation region and a diffusion region of the first polarity type, a band region of a second polarity type disposed directly beneath the buried insulator layer and forming a conductive path, a well region of the second polarity type disposed in the bulk substrate and in contact with the band region, a deep trench filled with a conductive material of the first polarity type disposed within the well region, and an electrostatic discharge (ESD) protect diode defined by a junction between a lower portion of the deep trench and the well region.
申请公布号 US8080851(B2) 申请公布日期 2011.12.20
申请号 US20080201462 申请日期 2008.08.29
申请人 BARTH, JR. JOHN E.;BERNSTEIN KERRY;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BARTH, JR. JOHN E.;BERNSTEIN KERRY
分类号 H01L23/62 主分类号 H01L23/62
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