发明名称 Semiconductor device and manufacturing method thereof
摘要 A method of manufacturing a semiconductor device includes the steps of forming a first columnar semiconductor layer on a substrate forming a first flat semiconductor layer forming a first semiconductor layer of a second conductive type, and forming a first insulating film. The method further includes the steps of forming a gate insulating film and a gate electrode, forming a second semiconductor layer of the second conductive type, forming a semiconductor layer of a first conductive type and forming a metal-semiconductor compound. The first insulating film has a thickness larger than that of the gate insulating film formed around the first columnar silicon layer.
申请公布号 US8080458(B2) 申请公布日期 2011.12.20
申请号 US20100761735 申请日期 2010.04.16
申请人 MASUOKA FUJIO;NAKAMURA HIROKI;ARAI SHINTARO;KUDO TOMOHIKO;SINGH NAVAB;BUDDHARAJU KAVITHA DEVI;NANSHENG SHEN;SAYANTHAN RUKMANI DEVI;UNISANTIS ELECTRONICS SINGAPORE PTE. LTD. 发明人 MASUOKA FUJIO;NAKAMURA HIROKI;ARAI SHINTARO;KUDO TOMOHIKO;SINGH NAVAB;BUDDHARAJU KAVITHA DEVI;NANSHENG SHEN;SAYANTHAN RUKMANI DEVI
分类号 H01L21/336 主分类号 H01L21/336
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