| 摘要 |
<p>A method for fabricating a reservoir capacitor of a semiconductor device where a first peripheral circuit region and a second peripheral circuit region are defined comprises: forming a gate on an upper portion of a semiconductor substrate of the second peripheral circuit region; forming an interlayer insulating film on the entire upper portion of the semiconductor substrate including the gate; etching the interlayer insulating film of the second peripheral circuit region to form a bit line contact hole; forming a bit line material and a sacrificial film on the upper portion of the interlayer insulating film including the bit line contact hole; and etching the sacrificial film of the first peripheral circuit region to form a trench that exposes the bit line material.</p> |
