| 摘要 |
PURPOSE: A test dummy substrate and a manufacturing method thereof are provided to improve adhesive force with epoxy mold compound by forming a hexagonal solid pattern on a top layer part which is formed on the upper side of a base substrate. CONSTITUTION: A base plate(110) is manufactured by forming an index hole(117). A copper layer is respectively attached to top and bottom side of a second epoxy baseboard. A top layer part is formed by patterning a top copper layer of the second epoxy baseboard. The top layer part is attached to a top layer part formation area of the base plate. A penetration hole(130) passing through the base plate and top layer part is formed. A first leaking prevention groove for preventing the leaking of EMC(Epoxy Mold Compound) is formed on an edge which is separated from the end side of the base plate.
|
