发明名称 |
Printed circuit board manufacturing method |
摘要 |
A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad.
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申请公布号 |
US8079142(B2) |
申请公布日期 |
2011.12.20 |
申请号 |
US20080273939 |
申请日期 |
2008.11.19 |
申请人 |
SAKAMOTO HAJIME;SUGIYAMA TADASHI;WANG DONGDONG;KARIYA TAKASHI;IBIDEN CO., LTD. |
发明人 |
SAKAMOTO HAJIME;SUGIYAMA TADASHI;WANG DONGDONG;KARIYA TAKASHI |
分类号 |
H01K3/10;H01L21/48;H01L21/60;H01L23/13;H01L23/498;H01L23/538;H01L23/544;H05K1/16;H05K1/18;H05K7/10 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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