Structure of multi-row leadless lead frame semiconductor package by low-k and manufacture method thereof

摘要

PURPOSE: A lead frame semiconductor package using low-k materials and a manufacturing method thereof are provided to reduce power loss by forming a low dielectric material between die pad side I/O terminals. CONSTITUTION: An inner I/O part or a die-pad part is patterned(ST1). The gap filling process is operated by using the low dielectric material(ST2). The gap filling process is operated by forming the mixture of the low dielectric material and SR(Solder Regist) or the low dielectric substance membrane and SR film. A conductive layer is formed in the inner I/O or the die-pad part(ST3). A semiconductor chip is mounted(ST4). A procss of a wire bonding is operated(ST5). A package is formed(ST6).