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发明名称
Semiconductor package
摘要
申请公布号
KR101096041(B1)
申请公布日期
2011.12.19
申请号
KR20090122307
申请日期
2009.12.10
申请人
发明人
分类号
H01L27/04
主分类号
H01L27/04
代理机构
代理人
主权项
地址
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