发明名称 Laser machining apparatus and Method for manufacturing multi-layer substrate using the same
摘要 PURPOSE: A laser machining apparatus and a method for manufacturing multi-layered substrates is provided to minimize the movement of a beam irradiating unit or a stage unit since a line beam is irradiated at a fixed angle in a machine direction. CONSTITUTION: A laser machining apparatus comprises a laser source(10), a stage unit(50), a beam forming unit(30), and a beam irradiating unit(40). The laser source irradiates the laser beam. The stage unit moves in the X-Y directions. The beam forming unit optically forms laser beam to produce one-dimensional line beam. The beam irradiating unit irradiates one-dimensional line beam to firstly process a partial layer of a multi-layered substrate(100) on the stage unit, irradiates laser beam, and secondly processes the rest layers or a part of the multi-layered substrate.
申请公布号 KR101094322(B1) 申请公布日期 2011.12.19
申请号 KR20090056779 申请日期 2009.06.25
申请人 发明人
分类号 B23K26/082;B23K26/062;H05K3/00 主分类号 B23K26/082
代理机构 代理人
主权项
地址