CMP PAD CONDITIONER AND ITS MANUFACTURING METHOD

摘要

PURPOSE: A chemical mechanical polishing pad conditioner and a manufacturing method thereof are provided to form diamond abrasive-grains into desired height in a desired location by controlling the height of a supporting layer of the abrasive-grains. CONSTITUTION: A photosensitive film is formed on the surface of a metallic material(10). A mask layer having openings in which area is deferent by eliminating the photosensitive film to different size in a plurality of domains. Lower plating layers in which height is different are formed within the opening by plating the surface of the metallic material in which the mask layer is formed. Height difference of diamond abrasive-grains is formed by arranging the diamond abrasive-grains in each lower plating layer in which height is different. A finishing plating layer(40) which covers the diamond abrasive-grains and the surface of the metallic material in which the mask layer is eliminated is formed.