发明名称 |
Semiconductor memory device and semiconductor memory card |
摘要 |
A semiconductor memory card includes a wiring board which has a first pad region along a first long side and a second pad region along a second long side. First memory chips which configure a first chip group are stacked in a step-like shape on the wiring board. Second memory chips which configure a second chip group are stacked in a step-like shape on the first chip group with the direction reversed. The electrode pads of the first memory chips are electrically connected to the connection pads arranged on the first pad region, and the electrode pads of the second memory chips are electrically connected to the connection pads arranged on the second pad region.
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申请公布号 |
US8080868(B2) |
申请公布日期 |
2011.12.20 |
申请号 |
US20100939210 |
申请日期 |
2010.11.04 |
申请人 |
NISHIYAMA TAKU;OKUMURA NAOHISA;OKADA KIYOKAZU;KABUSHIKI KAISHA TOSHIBA |
发明人 |
NISHIYAMA TAKU;OKUMURA NAOHISA;OKADA KIYOKAZU |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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