发明名称 |
Integrated circuit packaging system with multi level contact and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a first level contact on a first external connection level; forming a second level contact on a second external connection level next to the first external connection level; attaching a device adjacent the first level contact and the second level contact; attaching a first level device connector to the first level contact and the device; attaching a second level device connector to the second level contact and the device; and forming an encapsulant over the first level contact, the second level contact, the first level device connector, and the second level device connector.
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申请公布号 |
US8080885(B2) |
申请公布日期 |
2011.12.20 |
申请号 |
US20080273547 |
申请日期 |
2008.11.19 |
申请人 |
CHOW SENG GUAN;KUAN HEAP HOE;HUANG RUI;STATS CHIPPAC LTD. |
发明人 |
CHOW SENG GUAN;KUAN HEAP HOE;HUANG RUI |
分类号 |
H01L23/28;H01L21/56;H01L21/60;H01L23/31;H01L23/48 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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