发明名称 SEMICONDUCTOR PACKAGE HAVING FUNCTIONS OF WIRELESS SIGNAL TRANSMISSION AND WIRELESS POWER DRIVING
摘要 <p>PURPOSE: A semiconductor package having functions of wireless signal transmission and wireless power driving are provided to reduce costs for a semiconductor package without wire or ball. CONSTITUTION: In a semiconductor package having functions of wireless signal transmission and wireless power driving, a substrate(1) comprises a base part(10), a wireless power supply unit(30), and a substrate wireless signal part(40). The base part comprises a first side(12) and a second side(14). A wireless power supply unit supplies power to the base part and a semiconductor chip The wireless power supply unit receives power through a non-radiative method using magnetic field resonance The wireless power supply unit includes a power transmitter and a power receiver.</p>
申请公布号 KR20110135151(A) 申请公布日期 2011.12.16
申请号 KR20100054897 申请日期 2010.06.10
申请人 STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD. 发明人 KIM, HYUN CHAN;SHIM, JOON SUB
分类号 H01L27/04;H01L25/00;H04L12/28 主分类号 H01L27/04
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