发明名称 |
SEMICONDUCTOR PACKAGE HAVING FUNCTIONS OF WIRELESS SIGNAL TRANSMISSION AND WIRELESS POWER DRIVING |
摘要 |
<p>PURPOSE: A semiconductor package having functions of wireless signal transmission and wireless power driving are provided to reduce costs for a semiconductor package without wire or ball. CONSTITUTION: In a semiconductor package having functions of wireless signal transmission and wireless power driving, a substrate(1) comprises a base part(10), a wireless power supply unit(30), and a substrate wireless signal part(40). The base part comprises a first side(12) and a second side(14). A wireless power supply unit supplies power to the base part and a semiconductor chip The wireless power supply unit receives power through a non-radiative method using magnetic field resonance The wireless power supply unit includes a power transmitter and a power receiver.</p> |
申请公布号 |
KR20110135151(A) |
申请公布日期 |
2011.12.16 |
申请号 |
KR20100054897 |
申请日期 |
2010.06.10 |
申请人 |
STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD. |
发明人 |
KIM, HYUN CHAN;SHIM, JOON SUB |
分类号 |
H01L27/04;H01L25/00;H04L12/28 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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