EPOXY RESIN COMPOSITION HAVING EXCELLENT ELECTRICAL CHARACTERISTICS FOR SEALING SEMICONDUCTOR

摘要

PURPOSE: An epoxy resin compostion is provided to increase the volume resistivity of epoxy resin by including cerium oxide which has packed structure, and improve high-temperature reverse bias. CONSTITUTION: An epoxy resin composition comprises epoxy resin, hardener, filler, and cerium oxide as additive. The amount of the additive is 0.1-1wt% on the basis of the amount of total resin composition. The specific gravity and the average particle size of additive is 3-9gcm^3 and 2.0 micron or less at 15.6°C, respectively. The content of epoxy resin and hardener is 3-10wt% and 3-8wt% on the basis of the content of total epoxy resin composition respectively.