发明名称 HEAT-RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 <p>PURPOSE: A heat-radiating substrate and a manufacturing method thereof are provided to rapidly dispose of heat which is generated from a heating device by using aluminum as a core metal layer and alumina as a core insulating layer. CONSTITUTION: In a heat-radiating substrate and a manufacturing method thereof, a core layer(110) comprises a core metal layer(111) and a core insulating layer(112). The core layer is comprised of a first region and a second region. A circuit layer(120) is formed in the first region of the core layer. A build-up layer(130) is formed in the second region of the core layer and includes the build-up insulating layer(131) and a build up circuit layer(132). The core insulating layer is formed by oxidizing the core metal layer. The circuit layer is formed in both sides of the core layer and includes a via electrically connecting the circuit layer.</p>
申请公布号 KR101095100(B1) 申请公布日期 2011.12.16
申请号 KR20100056030 申请日期 2010.06.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LIM, CHANG HYUN;KANG, JUNG EUN;CHOI, SEOG MOON;KIM, KWANG SOO;CHAE, JOON SEOK;PARK, SUNG KEUN
分类号 H05K1/02;H05K3/46;H05K7/20 主分类号 H05K1/02
代理机构 代理人
主权项
地址