发明名称 |
SEMICONDUCTOR PACKAGE |
摘要 |
PURPOSE: A semiconductor package is provided to suppress failure even if long time passes by reducing heat which is generated inside a semiconductor package. CONSTITUTION: In a semiconductor package, a substrate has a first side and a second side. The substrate includes a base part(10) and a substrate wireless signal unit which is formed in the base part. A semiconductor chip(100) transmits and receives data to the substrate and a radio signal. A thermoelectric unit(70) controls the temperature of the semiconductor chip and the substrate. The heat generated from the semiconductor chip is emitted through a heat sink(90) to outside. |
申请公布号 |
KR20110135153(A) |
申请公布日期 |
2011.12.16 |
申请号 |
KR20100054899 |
申请日期 |
2010.06.10 |
申请人 |
STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD. |
发明人 |
RHEE, WON SANG;CHOI, KWANG HYUN |
分类号 |
H01L25/00;H01L23/34;H04L12/28 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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