HEAT RADIATING PRINTED CIRCUIT BOARD AND PROCESS OF THE SAME

摘要

PURPOSE: A heat radiating printed circuit board and process of the same are provided to maximize heat radiation by forming a protrusion of which is anodizing-processed in the surface of a metal substrate. CONSTITUTION: A metal board(10) has a heat dissipation protrusion(15). A metal oxide layer(20) is formed on the surface of the metal board. An insulating layer(30) is formed in the metal oxide layer. A copper foil layer(40) is formed in the top of the insulator to be contact with a heating device. The metal oxide layer is formed on the surface of the metal board and is formed over the heat dissipation protrusion.