IN-LINE APPARATUS HAVING A WIRELESS AUTOMATIC TEST EQUIPMENT AND DICING EQUIPMENT AND OPERATION METHOD THEREOF

摘要

PURPOSE: An inline apparatus and an operation method thereof are provided to apply a wireless signal and wireless power to a semiconductor wafer, thereby performing a dicing process and electrical inspection process with respect to a semiconductor chip. CONSTITUTION: A semiconductor wafer is inserted into a loading part(400). An inspection part performs an electrical inspection process with respect to the semiconductor wafer through a wireless signal and wireless power. A dicing part(600) separates an individual semiconductor chip from the inspection-completed semiconductor wafer. An unloading part(700) discharges the dicing-completed semiconductor wafer to the outside of equipment. The semiconductor wafer comprises a wireless signal transceiver part, a wireless signal control part, and a wireless power generation part in the inside.