LASER DRILLING APPARATUS FOR FORMING VIA HOLES HAVING FUNCTION OF WIRELESS SIGNAL INSPECTION AND A PROCESSING METHOD THEREOF

摘要

PURPOSE: A laser apparatus for machining a via hole having a wireless signal inspection function and a machining method thereof are provided to rapidly array a substrate through the transmission of a wireless signal. CONSTITUTION: A laser apparatus for machining a via hole having a wireless signal inspection function comprises a worktable(10), a wireless signal unit(40), a wireless power source unit(30), a laser unit(20), and a test unit. The worktable comprises a substrate loading unit(18) in which a substrate(110) is placed. The wireless signal unit is located at the top of the worktable and transmits a wireless signal to an external device. The laser unit irradiates a laser for forming via holes. The test unit tests the via holes and semiconductor chips(100).