SEMICONDUCTOR PACKAGE HAVING FUNCTION OF HEAT DISSIPATION

摘要

PURPOSE: A semiconductor package having function of heat dissipation is provided to improve the reliability of a semiconductor package by preventing the deterioration of package efficiency due to heat. CONSTITUTION: In a semiconductor package having function of heat dissipation, a first semiconductor chip(410) comprises a first side and a second side which are opposite to the first side. A thermoelectric part(70) is interposed between the first semiconductor chip and a substrate. The thermoelectric part comprises a thermoelectric element(72) and a power supply unit(74). A molding material(5) surrounds the substrate, the first semiconductor chip, the thermoelectric part, and the insulating layer.