SEMICONDUCTOR WAFER HAVING A ALIGNMENT MARK FOR WAFER BONDING AND PROCESSING METHOD THEREOF

摘要

PURPOSE: A semiconductor wafer having a alignment mark for a wafer bonding and a processing method thereof are provided to align the position of an individual semiconductor wafer by bonding a wafer up and down. CONSTITUTION: In a semiconductor wafer having a alignment mark for a wafer bonding and a processing method thereof, an individual semiconductor chip(102) is divided by a scribe line within a semiconductor wafer(100A). A plurality of via holes(104) is formed in one end of the semiconductor wafer. An alignment mark(106A) is formed in a region in which the via hole is formed. The alignment mark is formed in the semiconductor wafer through the via hole.