| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the leakage of sealing resin to the outside of an optical semiconductor device and the occurence of bubbles in the sealing resin. <P>SOLUTION: Void areas 107 are provided at boundary surfaces with either one of a lead frame 103 and a radiator or with both the lead frame 103 and the radiator of resin 104. Thus, even if sealing resin 108 penetrates in gaps formed on the boundary surfaces, the sealing resin 108 is accumulated in the void areas 107. Therefore, the leakage of the sealing resin 108 to the outside of an optical semiconductor device 101 and the occurrence of bubbles in the sealing resin 108 are suppressed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
