| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a formation method of a circuit board for a printed wiring board that allows a circuit pattern to be formed at a favorable fine pitch. <P>SOLUTION: The formation method of a circuit board for a printed wiring board comprises: a step of preparing a laminate of a resin substrate and a copper foil or a copper layer provided with a coating layer on a surface containing at least one component selected from platinum, palladium and gold where a coating weight of platinum is 1050 μg/dm<SP POS="POST">2</SP>or less, a coating weight of palladium is 600 μg/dm<SP POS="POST">2</SP>or less, and a coating weight of gold is 1000 μg/dm<SP POS="POST">2</SP>or less; a step of forming a resist pattern on a surface of the coating layer of the laminate; a step of treating the surface of the coating layer of the laminate on which the resist pattern is formed with a solution containing at least one component selected from hydrochloric acid, sulfuric acid and nitric acid to dissolve copper oxide contained in the surface of the coating layer in the solution; and a step of etching the surface of the coating layer of the laminate where the copper oxide is dissolved by an etchant containing CuCl<SB POS="POST">2</SB>and HCl. <P>COPYRIGHT: (C)2012,JPO&INPIT |
