| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition containing a phenol novolac resin having a biphenylene structure as a crosslinking group; and to provide a cured product of the same, a semiconductor device sealing material and a printed board of the same. <P>SOLUTION: The epoxy resin composition comprises a phenolnovolac resin having a biphenylene structure as a crosslinking group, an epoxy resin, and a curing accelerator. The epoxy resin composition preferably further comprises an inorganic filler. By using the epoxy resin composition, a semiconductor device sealing material, a prepreg and a printed board can be made. <P>COPYRIGHT: (C)2012,JPO&INPIT |
