发明名称 POWER MODULE AND METHOD FOR CONNECTING POWER MODULE TO PRINTED CIRCUIT BOARD AND HEAT SINK
摘要 <P>PROBLEM TO BE SOLVED: To provide a power module that is connectable to a printed circuit board and a heat sink without reducing the area of the printed circuit board. <P>SOLUTION: A power module 2 comprises dowel-shaped fixing elements 24 which are introducible into holes 31 of a heat sink 3. Clamping elements 25 are clamped in holes of the heat sink 3 as a result of being introduced into the dowel-shaped fixing elements through through holes 11 of a printed circuit board. Therefore, the power module is more easily connectable to the printed circuit board and the heat sink. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011254065(A) 申请公布日期 2011.12.15
申请号 JP20110066990 申请日期 2011.03.25
申请人 VINCOTECH HOLDINGS SARL 发明人 JANOS NAVIREC
分类号 H01L23/40;H05K7/20 主分类号 H01L23/40
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