Method of manufacturing mounting substrate

摘要

A method of manufacturing a mounting substrate, the method including: providing an insulation layer, the insulation layer having a circuit pattern formed in one side thereof; forming at least one bonding pad in the other side of the insulation layer, the bonding pad electrically connected with the circuit pattern; and etching the bonding pad such that a surface of the bonding pad is recessed from a surface of the insulation layer by a predetermined depth.