CONNECTING STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

Decreased connection reliability due to rotation of a lead when vibration is applied, and variability in the connection surface area, are problematic when ultrasonically connecting a lead and a conductive layer disposed on a substrate. This problem is addressed by the disclosed connection structure. When ultrasound processing is started, the contact surface area of the lead and the ultrasound tool is increased to a level greater than the contact surface area of the lead and the conductive layer. For example, one side surface of a lead having a circular cross-section is planarized and the ultrasound tool is pressed against said side surface to form the ultrasonic connection. Because the contact surface between the lead and the ultrasonic tool is greater, rotation of the lead is suppressed, and by having a smaller contact surface between the lead and the conductive layer, stress is concentrated at the connection area and the connection is formed more easily.