发明名称 |
ELEKTRONISCHES VERBUNDBAUTEIL UND VERFAHREN ZU SEINER HERSTELLUNG |
摘要 |
<p>A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.</p> |
申请公布号 |
AT535138(T) |
申请公布日期 |
2011.12.15 |
申请号 |
AT20050780155T |
申请日期 |
2005.07.27 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
NODA, SATORU;HARADA, JUN |
分类号 |
H05K1/18;H01L25/00;H05K1/14;H05K3/28 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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